High Performance Computing
Experience The Most Efficient HPC Cooling Solution
“Hot aisle containment did not have the thermal transfer capabilities required for our high performance computing lab. Chip cooling was never an option so we implemented OptiCool’s refrigerant rear-door and have been extremely pleased with the modularity and performance.”
Lab Director, Government Research Facility
- Is hot aisle containment limiting your high compute requirements?
- Having trouble with CFD room modeling?
- Chip cooling not an option?
Return on Investment
- Increase Rack Densities: Grow from 3kW to 60kW+
- Increase Cooling Capacity: 30,000 times more efficient than airflow
- Eliminate the need to cool the entire room